Kagor From Wikipedia, the free encyclopedia. Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Packaegs technology Through-hole technology. Parts are submerged in a polymerizable monomer or packagws low viscosity plastic solution. The design of these products depends on the production method and require careful consideration of dimensions and tolerances and tooling design.
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Kalmaran Today it is most widely used to protect semiconductor components from moisture and mechanical damage, and to serve as a mechanical structure holding the lead frame and the chip together.
Glop-top is a variant of ekectronic coating used in chip-on-board assembly COB. These requirements extend beyond and interact with the electrical design. After the vacuum is released, the fluid flows hermiticcity the part. Pl can be post-processed to provide conductive surfaces. Liquid filling is sometimes used as an alternative to potting or impregnation. Conformal coating is a thin insulating coating applied by various methods. It prevents ionization from forming between closely spaced live surfaces and initiating failure.
Gasketed metal castings are sometimes used to package electronic equipment for exceptionally severe environments, such as in heavy industry, aboard ship, or deep under water. In these, the individual diodes are mounted in an array that allows the device to produce psckages greater amount of luminous flux with greater ability to dissipate the resulting heat in an overall smaller package than can be accomplished by mounting LEDs, even surface mount types, individually on a circuit board.
Hermiticiy can be done in a pre-molded potting shell, or directly in a mold. Unsourced material may be challenged and removed. Some later tubes used metal cases and feedthroughs, and only the insulation around the individual feedthroughs used glass. It can be mechanically strong, provides electromagnetic shielding when the product requires that feature, and is easily made for prototypes and small production runs with little custom tooling expense.
It can also be used to improve heat transfer, especially if allowed to circulate by natural convection or forced convection through a heat exchanger. They are fairly common in microwave assemblies for aerospace use, where precision transmission lines require complex metal shapes, in combination with hermetically sealed housings. Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures. Electronic packaging — Wikipedia Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate.
Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid mechanics. Printed circuits are primarily a technology for connecting components together, but they also provide mechanical structure.
Many electrical products require the manufacturing of high-volume, low-cost parts such as enclosures or covers by techniques such as injection molding, die casting, investment casting, and so on. Liquid filling can be packagea for repair much more easily than potting. Industrial design Packaging Packaging microfabrication Chip carriers. Aluminum die castings are more common than iron or steel sand castings. Hermetic metal packaging began life in the vacuum tube industry, where a totally leak-proof housing was essential to operation.
Examples are injection molding, transfer molding, vacuum forming, and die cutting. Curing can consist of polymerizing the internal resin or evaporating the solvent, which leaves an insulating dielectric material between different voltage components. Please help improve this article by adding citations to reliable sources. The pressure above the fluid is lowered to a full vacuum. Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer.
Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. High-reliability equipment often must survive drop tests, loose cargo vibration, secured cargo vibration, extreme temperatures, humidity, water immersion or spray, rain, sunlight UV, IR and visible lightsalt spray, explosive shock, and many more. This also excludes dirt and conductive contaminants such as impure water from sensitive areas.
Articles needing additional references from December All articles needing additional references. It is most commonly used in electronic toys and low-end devices. It consists of a drop of specially formulated epoxy  or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. The same electronic system may be packaged as a portable device or adapted for fixed mounting in an instrument rack or permanent installation.
HERMITICITY OF ELECTRONIC PACKAGES PDF
Hermeticity of Electronic Packages